Thermal Management Materials
Thermal pads
Thermal pads
COOLPROVIDE™ CPLK
Feature
Noise level is lowered at low-frequencies compared with conventional thermally conductive sheets.
Low-dielectric thermally conductive sheet helps to reduce noise in GHz bands, which occurs by heat sink’s resonance phenomena.
Silicone-free type generates no siloxane gas and oil bleeding is reduced.
- Thermal pad
- Silicone-free
- EM wave suppression
- One side tacky
Materials
Specification
List （代表値）
| Material | Silicone-free | Feature | EM wave suppression, One side tacky |
|---|---|---|---|
| Color | Mauve | Specific gravity | 2.0 |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:11]] | Tracking resistance test CTI(V) | PCL:0 (≧600V)(t＝3.0ｍｍ) |
| Hardness(ASKER C) | 30 | Hardness(Shore OO) | 60 |
| Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 2.0 |
| Thermal conductivity(Hot Disk method)(W / m・K) | 1.4 | Phase change temperature(℃) | - |
| Permeability(μ') | - | Maximum effective dimensions(mm) | 200×500 |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
Part No. list
| Part No. | Thickness (mm) |
L1 (mm) |
L2 (mm) |
Flame retardance (UL) |
図面・3Dデータ・成績書 | Sample Request |
|---|---|---|---|---|---|---|
| CPLK-1.0F | 1.0 | - | - | V-0 equivalent | ||
| CPLK-1.5F | 1.5 | - | - | V-0 equivalent | ||
| CPLK-2.0F | 2.0 | - | - | V-0 equivalent |
Product Inquiry
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Suggestion of selection guide of expected Thermal Interface Product is also available.
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