Thermal Management Materials
Thermal pads
Thermal pads
COOLPROVIDE™（Both side tacky） CPSS
Feature
Super low-hardness (ASKER C 8) and excellent adhesiveness minimizes thermal resistance
With excellent stress relaxation properties, loads to devices and PCBs can be reduced after assembly.
Silicone-free, no siloxane outgassing
Unlike silicone pads, the silicone free pad bleeds hardly any oil and rarely causes problems to peripheral components.
Operating temperature range is from -40℃ to 100℃.
- Thermal pad
- Silicone-free
- Highly flexible
- Both side tacky
Materials
Specification
List （代表値）
| Material | Non-Silicon | Feature | High flexibility, Both side tacky, Available for UL |
|---|---|---|---|
| Color | Dark Green | Specific gravity | - |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:12]] | Tracking resistance test CTI(V) | PCL:0 (≧600V)(t＝3.0ｍｍ) |
| Hardness(ASKER C) | 8 | Hardness(Shore OO) | 33 |
| Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 2.0 |
| Thermal conductivity(Hot Disk method)(W / m・K) | 1.5 | Phase change temperature(℃) | - |
| Permeability(μ') | - | Maximum effective dimensions(mm) | 200×500 |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
Product Dimensions
Part No. list
| Part No. | Thickness (mm) |
L1 (mm) |
L2 (mm) |
Flame retardance (UL) |
図面・3Dデータ・成績書 | Sample Request |
|---|---|---|---|---|---|---|
| CPSS-3.0 | 3.0 | 210 | 510 | - | ||
| CPSS-4.0 | 4.0 | 210 | 510 | - |
Product Inquiry
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Suggestion of selection guide of expected Thermal Interface Product is also available.
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