Thermal Management Materials
Thermal pads
Thermal pads
HEAT SPREADER SHEET HSD
Feature
The aluminum heat spreader has an excellent thermal conductivity (221W/m•K), which dissipates heat in the in-plane direction.
Flexible material is suitable for curved surfaces and various thicknesses are available.
Optional electrically insulating layer (PET films, thermal pads) can be applied upon request.
Ideal thermal solutions for hot spots, such as mobile devices, tablets, routers etc.
- Thermal pad
- Silicone-free
- High thermal conductivity
- One side tacky
- Thin type
- Heat dissipation material
Materials
Thermally conductive adhesive layer
Specification
List （代表値）
| Material | Silicone-free | Feature | High thermal conductivity, One side tacky, Thin type, Heat dissipation material |
|---|---|---|---|
| Color | - | Specific gravity | - |
| Volume resistivity(Ω・cm) | - | Tracking resistance test CTI(V) | - |
| Hardness(ASKER C) | - | Hardness(Shore OO) | - |
| Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 221 |
| Thermal conductivity(Hot Disk method)(W / m・K) | - | Phase change temperature(℃) | - |
| Permeability(μ') | - | Maximum effective dimensions(mm) | - |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
Product Dimensions
Part No. list
| Part No. | Thickness (mm) |
L1 (mm) |
L2 (mm) |
Flame retardance (UL) |
図面・3Dデータ・成績書 | Sample Request |
|---|---|---|---|---|---|---|
| HSD-0.22 | 0.22 | - | - | - | ||
| HSD-0.30 | 0.30 | - | - | - |
Product Inquiry
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Suggestion of selection guide of expected Thermal Interface Product is also available.
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